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Adhesion Promoter
Adhesion Promoter
To adjust the properties of films, blends (mixtures) can be created. However, this only works to a certain extent and only if the materials have a certain affinity for each other. Often, it is better to produce multilayer films instead. For polymers with low affinity, adhesion promoters are used to bond otherwise incompatible films. This way, PE/PA films can be produced that combine the good gas barrier properties of polyamide with the excellent water vapor barrier of polyethylene.
To adjust the properties of films, blends (mixtures) can be created. However, this only works to a certain extent and only if the materials have a certain affinity for each other. Often, it is better to produce multilayer films instead. For polymers with low affinity, adhesion promoters are used to bond otherwise incompatible films. This way, PE/PA films can be produced that combine the good gas barrier properties of polyamide with the excellent water vapor barrier of polyethylene.
Applications
Applications
Packaging films: PA/PE films for food packaging with a balanced gas and water vapor barrier
Hot-melt laminating films: films with adhesion promoters bond with materials such as aluminum and provide corrosion protection
Photovoltaic films: adhesion promoter films are used as “hot melt adhesives” in modules to permanently bond and protect glass, cells, and metals
Packaging Films: PA/PE films for food packaging, offering a balanced gas and water vapor barrier.
Heat Laminating Films: The film with adhesion promoters bonds with materials like aluminum, providing corrosion protection.
Photovoltaic Films: Adhesion promoter films are used as hot glue in modules, permanently bonding and protecting materials such as glass, cells, and metals.
Packaging Films: PA/PE films for food packaging, offering a balanced gas and water vapor barrier.
Heat Laminating Films: The film with adhesion promoters bonds with materials like aluminum, providing corrosion protection.
Photovoltaic Films: Adhesion promoter films are used as hot glue in modules, permanently bonding and protecting materials such as glass, cells, and metals.